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Introducing the new, integrated range of Gulmay GMF microfocus x-ray sources.

The GMF series of integrated x-ray sources offer outstanding performance and reliability in a compact package. Available in 90kV, 4 micron and 130kV, 8 micron configurations, the new GMF integrated sources offer a simple and straightforward solution to microfocus imaging requirements.

Contact your local Gulmay Sales Office or Authorized Gulmay Distributor for availability and pricing.

Xray Power Supply and Xray Source in a Single Housing

The GMF series of integrated x-ray sources offer outstanding performance and reliability in a compact package. Available in 90kV, 4 micron and 130kV, 8 micron configurations, the new GMF integrated sources offer a simple and straightforward solution to microfocus imaging requirements.

With an oil-filled high voltage module which follows the proven Gulmay design philosophy, these compact x-ray sources offer precise, repeatable and stable x-ray emission with high output power and strong penetration ability.

GMF series microfocus generators are supplied with control software for standalone operation while OEM system integration is easily achieved using the standard communication protocol set.

Features & Benefits

  • Round focal spot optimized over the range of operating voltage and power, distortion free images at high resolution
  • Minimum spot size of 5 microns at 4 watts (GMF90) and 8 microns at 4 watts (GMF130) for high resolution imaging
  • Can be oriented vertically or horizontally for flexible configuration and installation
  • Automatic warm-up routines ensure tube longevity
  • Hot anode technology ensures highest reliability and lifetime

Applications

  • SMT, PCBA Electronic Manufacturing
  • Semiconductor packages
  • IGBT Substrate / Module
  • 3C devices
  • Battery inspection
  • Precision parts inspection

Microfocus Inspection Applications (WIP)

  • Battery inspection
  • Electronics microfocus inspection
    • Circuit board inspection
    • Integrated circuits / IC inspection
    • Soldering joints on circuit boards – PCBA
    • Surface mount (SMT) inspection
  • Ball grid arrays – BGA
  • Bonding wires
  • Semiconductor packaging and interconnects
  • Wafer-level chip-scale packages
PRODUCTKVMAPOWERSPOT SIZE @ max kV
GMF9020 - 90kV0 - 180µA0 - 8WSee datasheet
GMF13040 - 130kV0 - 500µA0 - 65WSee datasheet

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